We implement a full range of engineering practices to develop reliable circuits: high-density PCB layouts, SoC, multilayer/ flexible boards, high-speed interfaces (multicore CPU, DDR, DDR2, DDR3, FPGA, CPLD, eMMC, NAND), wireless channels (Zigbee, WiFi, Z-wave, NFC, GSM, 3G, LTE, etc.), video and audio processing circuits, systems with autonomous power supplies (Li-ion/Li-pol elements), wireless Qi energy transfer, external energy harvesters, etc.